Posted By
DarwinNE
on 2019-02-21
08:55:24
|  Re: Heatsinking or not heatsinking?
Hi,
I'm the author of the original article cited by Luca.
Unfortunately, hot spots would not be very visible with a thermal camera without exposing the die, the package is probably too thick.
It would be great if a heatsink would be able to remove the problem created by a hot spot on the silicon, but it is simply too far from it and this function is done by the packaging itself as much as it can. BTW, the die is attached on a lead frame that helps spreading the heat and keep temperatures down. Some DIL packages even included (even in 1984) a heat spreader, but I don't know if this is done with the TED and the CPU.
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